PMEG40T20ERX: 40 V, 2 A low VF Trench MEGA Schottky barrier rectifier, SOD123W package
Nexperia

The PMEG40T20ER from Nexperia is a Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier, designed to enhance power efficiency in various applications. It is encapsulated in a CFP3 (SOD123W) package, which is a small and flat lead Surface-Mounted Device (SMD) plastic package, making it suitable for compact designs.

This component features an average forward current of 2 A and a reverse voltage capacity of up to 40 V. It utilizes Trench MEGA Schottky technology to achieve low forward voltage and leakage current, contributing to its high efficiency. Additionally, the use of clip-bonding technology enhances its power capability. It is also designed to be compatible with both reflow and wave soldering processes, ensuring ease of integration into various manufacturing workflows.

Key Specifications and Features

  • Average forward current (IF(AV)): 2 A
  • Reverse voltage (VR): ≤ 40 V
  • Forward voltage (VF): 450 to 515 mV at IF = 2 A
  • Reverse current (IR): 3 to 22 µA at VR = 40 V
  • Thermal resistance, junction to ambient (Rth(j-a)): 220 K/W (standard footprint), 130 K/W (mounting pad for cathode 1 cm2)
  • Reverse recovery time (trr): 11.5 ns
  • Diode capacitance (Cd): 145 to 350 pF at VR = 1 to 10 V
  • Package: CFP3 (SOD123W)

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Applications

  • Low voltage rectification
  • High efficiency DC-to-DC conversion
  • Switch mode power supply
  • Freewheeling application
  • Reverse polarity protection
  • Low power consumption application

Category

Diodes

General information

Schottky barrier rectifiers are semiconductor diodes that provide low forward voltage drop and rapid switching capabilities. These characteristics make them highly suitable for high-frequency and power-sensitive applications, such as power supply circuits, DC-DC converters, and reverse polarity protection circuits.

When selecting a Schottky barrier rectifier, engineers should consider parameters such as the maximum reverse voltage, forward current capacity, forward voltage drop, and package type. The choice of a Schottky diode depends on the specific requirements of the application, including power efficiency, size constraints, and thermal management needs.

Trench MEGA Schottky technology further enhances the performance of these diodes by reducing leakage current and improving thermal characteristics. This technology, combined with advanced packaging techniques like clip-bonding, allows for higher power handling and efficiency.

In addition to electrical parameters, the thermal performance of the diode is also a critical factor. Effective thermal management ensures the diode operates within its temperature limits, thereby extending its lifespan and reliability in the circuit.

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