The Broadcom HSMG-C170 is part of a wide range of Surface Mount ChipLEDs designed for easy handling and use in a variety of applications. These ChipLEDs are notable for their small size and compatibility with IR reflow solder processes, making them suitable for high-volume manufacturing. The HSMG-C170, in particular, offers a compact 2.0mm x 1.25mm footprint with a 0.8mm profile, optimized for applications where space is at a premium.
These LEDs provide diffused optics, ensuring uniform light distribution and making them ideal for backlighting and front-panel illumination. With an operating temperature range of -40°C to +85°C, they are equipped to handle a wide range of environmental conditions. The HSMG-C170 ChipLEDs are available in various colors, allowing designers to choose the optimal hue for their specific application needs.
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Surface Mount Device (SMD) ChipLEDs are a fundamental component in modern electronic design, providing efficient, compact lighting solutions across a broad spectrum of applications. These LEDs are particularly valued for their small size, low power consumption, and high reliability, making them ideal for use in portable devices, consumer electronics, automotive applications, and industrial equipment.
When selecting an SMD ChipLED, engineers should consider factors such as size, color, brightness, and power requirements. The footprint and profile of the LED are critical for ensuring it fits within the spatial constraints of the design. Additionally, the choice of color can significantly impact the aesthetics and functionality of the final product. Compatibility with manufacturing processes, such as IR reflow soldering, is also important to facilitate efficient assembly.
The operating temperature range of an LED is another vital specification, as it indicates the environmental conditions the component can withstand. For applications subjected to harsh or variable conditions, selecting an LED with a wide operating temperature range is essential. Lastly, the availability of the component in tape and reel packaging can streamline the manufacturing process, enabling automated pick and place operations.